Accurate full-chip estimation of power map, current densities and temperature for EM assessment

Marko Chew, A. Aslyan, J. Choy, Xin Huang
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引用次数: 5

Abstract

Full-chip power ground electro-migration assessment requires a power map, thermal map and checks for IR drops exceeding the design specifications. This paper provides a survey of the three main computation operations required to get these information.
准确的全芯片估计功率图,电流密度和温度的EM评估
全芯片电源接地电迁移评估需要功率图、热图和超过设计规格的红外下降检查。本文概述了获取这些信息所需的三种主要计算操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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