{"title":"Accurate full-chip estimation of power map, current densities and temperature for EM assessment","authors":"Marko Chew, A. Aslyan, J. Choy, Xin Huang","doi":"10.1109/ICCAD.2014.7001389","DOIUrl":null,"url":null,"abstract":"Full-chip power ground electro-migration assessment requires a power map, thermal map and checks for IR drops exceeding the design specifications. This paper provides a survey of the three main computation operations required to get these information.","PeriodicalId":426584,"journal":{"name":"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","volume":"27 6","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.2014.7001389","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Full-chip power ground electro-migration assessment requires a power map, thermal map and checks for IR drops exceeding the design specifications. This paper provides a survey of the three main computation operations required to get these information.