Architecture and performance of 3-dimensional SOI circuits

R. Zhang, K. Roy, D. Janes
{"title":"Architecture and performance of 3-dimensional SOI circuits","authors":"R. Zhang, K. Roy, D. Janes","doi":"10.1109/SOI.1999.819850","DOIUrl":null,"url":null,"abstract":"In this paper, potential three-dimensional SOI CMOS VLSI circuit structures are laid out. Chip area, layout complexities, process costs, and impact on circuit performance are compared and discussed.","PeriodicalId":117832,"journal":{"name":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1999-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.1999.819850","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 28

Abstract

In this paper, potential three-dimensional SOI CMOS VLSI circuit structures are laid out. Chip area, layout complexities, process costs, and impact on circuit performance are compared and discussed.
三维SOI电路的结构与性能
本文给出了潜在的SOI CMOS VLSI三维电路结构。对芯片面积、布局复杂性、工艺成本以及对电路性能的影响进行了比较和讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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