Thermoelectric properties and electrode bonding performance for metal silicides

T. Kajikawa, T. Sugiyama, M. Serizawa, K. Kamio, M. Koike, T. Ohta, M. Omori
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引用次数: 2

Abstract

Thermoelectric properties of metal silicides and their electrode bonding performance have been examined. Metal silicides such as chromium silicide, magnesium silicide and so on are environmentally friendly and abundant. These characters are very much important for thermoelectric power generation application. The thermoelectric properties of these materials made by the hot-press sintering method followed with spark plasma sintering method make them promising candidates for intermediate and high temperature thermoelectric applications, in particular, such as thermoelectric power generation topping co-generation system. The temperature dependence of thermoelectric performance such as the thermopower, electrical resistivity, power factor, thermal conductivity, carrier concentration, Hall mobility for Mn- and Ag- doped Chromium Silicide was characterized between room temperature and 1000 K. The shift of the peak performance of the power factor for the temperature range was observed with the dopant concentration. The electrode formation with magnesium silicide element was carried out using diffusion bonding method to Ta/Al/Mg/sub 2/Si system. The bonding characteristics were discussed from the viewpoint of the electrical performance and inspection of the diffusion behavior of the electrode and inserted metal at the junction layer.
金属硅化物的热电性能和电极键合性能
研究了金属硅化物的热电性能及其电极键合性能。金属硅化物如硅化铬、硅化镁等对环境友好,储量丰富。这些特性对于热电发电的应用是非常重要的。通过热压烧结法和火花等离子烧结法制备的这些材料的热电性能使其成为中高温热电应用的有希望的候选材料,特别是热电发电和热电联产系统。研究了Mn和Ag掺杂硅化铬的热电性能,如热功率、电阻率、功率因数、导热系数、载流子浓度、霍尔迁移率等在室温至1000 K范围内的温度依赖性。在温度范围内,功率因数的峰值性能随掺杂剂浓度的变化而变化。采用扩散键合的方法在Ta/Al/Mg/sub - 2/Si体系中制备硅化镁元素电极。从电学性能和电极与连接层插入金属的扩散行为检测的角度讨论了键合特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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