Investigations on the ruggedness limit of 6.5 kV IGBT

J. Bauer, O. Schilling, C. Schaeffer, F. Hille
{"title":"Investigations on the ruggedness limit of 6.5 kV IGBT","authors":"J. Bauer, O. Schilling, C. Schaeffer, F. Hille","doi":"10.1109/ISPSD.2005.1487953","DOIUrl":null,"url":null,"abstract":"The save operating area (SOA) of high voltage 6.5 kV IGBTs has been investigated. The ruggedness of the IGBT with planar cell structure is limited by the hole current density in the cell structure arriving from the avalanche generation under turn-off conditions. The impact of current density, V/sub cc/ and vertical IGBT structure on the ruggedness has been taken into account. With a modified cell design the avalanche generation can be reduced significantly. Simulations with a trench IGBT promises additional SOA improvement.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"4 6","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2005.1487953","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16

Abstract

The save operating area (SOA) of high voltage 6.5 kV IGBTs has been investigated. The ruggedness of the IGBT with planar cell structure is limited by the hole current density in the cell structure arriving from the avalanche generation under turn-off conditions. The impact of current density, V/sub cc/ and vertical IGBT structure on the ruggedness has been taken into account. With a modified cell design the avalanche generation can be reduced significantly. Simulations with a trench IGBT promises additional SOA improvement.
6.5 kV IGBT耐压极限的研究
研究了高压6.5 kV igbt的节省工作面积(SOA)。具有平面胞体结构的IGBT的坚固性受限于胞体结构中在关断条件下雪崩产生的空穴电流密度。考虑了电流密度、V/sub cc/和垂直IGBT结构对坚固性的影响。通过改进单元设计,可以显著减少雪崩的产生。使用堑壕式IGBT进行模拟可以保证额外的SOA改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信