Embedded ceramic interconnect bridge in organic substrate for heterogeneous integration and multi-chip packaging

Abstract

In this paper, we describe the architecture and performance of a fine pitch multi-chip heterogeneous integration solution using embedded ceramic interconnect bridge (ECIB) in organic substrate package. We present the increased IO density and the improvement of electrical high-speed performance on signal integrity are achievable through this novel integration scheme, where small ceramic elements are embedded and served as interconnect bridges in organic substrate.