Mixed-signal SoC testing: is mixed-signal design-for-test on its way?

C. Wey, A. Osseiran, J. Huertas, Yeon-Chen Nieu
{"title":"Mixed-signal SoC testing: is mixed-signal design-for-test on its way?","authors":"C. Wey, A. Osseiran, J. Huertas, Yeon-Chen Nieu","doi":"10.1109/ATS.2000.893595","DOIUrl":null,"url":null,"abstract":"The world market for electronic systems will reach $1 Trillion within a year and with further exponential growth over the next five years. The growth in areas such as telecommunications has increased the demand for creating single chip solutions to system. This has been achieved by integrating a number of complex sub-systems, including standard interface blocks (e.g., analog/digital converters), reused design cores (e.g., memory or microprocessors), embedded software, and new, innovative, custom designed “user blocks”, into a single chip. Today, system-on-a-chip (SoC) has become a reality. However, the complexity of SoC makes it very difficult to achieve the desire test coverage without affecting the design schedule.","PeriodicalId":403864,"journal":{"name":"Proceedings of the Ninth Asian Test Symposium","volume":"253 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Ninth Asian Test Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.2000.893595","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The world market for electronic systems will reach $1 Trillion within a year and with further exponential growth over the next five years. The growth in areas such as telecommunications has increased the demand for creating single chip solutions to system. This has been achieved by integrating a number of complex sub-systems, including standard interface blocks (e.g., analog/digital converters), reused design cores (e.g., memory or microprocessors), embedded software, and new, innovative, custom designed “user blocks”, into a single chip. Today, system-on-a-chip (SoC) has become a reality. However, the complexity of SoC makes it very difficult to achieve the desire test coverage without affecting the design schedule.
混合信号SoC测试:混合信号测试设计正在进行中吗?
全球电子系统市场将在一年内达到1万亿美元,并在未来五年内进一步呈指数级增长。电信等领域的增长增加了对创建系统单芯片解决方案的需求。这是通过将许多复杂的子系统,包括标准接口模块(例如,模拟/数字转换器),重用的设计核心(例如,存储器或微处理器),嵌入式软件和新的,创新的,定制设计的“用户模块”集成到单个芯片中来实现的。如今,片上系统(SoC)已经成为现实。然而,SoC的复杂性使得在不影响设计进度的情况下实现期望的测试覆盖率非常困难。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信