Reflow Oven for Heating and Soldering SMD and BGA Components

Abstract

This paper presents a design and realization of a universal reflow oven for both heating and soldering of SMD components, including rebailing of BGA packages. The reflow oven is composed of two blocks in separate housings: a control system and a heating system. The control system was built with the Siemens SIMATIC S7-1200 PLC (programmable logic controller) with additional modules. The heating system consists of a three-zoned thermally isolated heating chamber with an original upper inspection window. Some original solutions were proposed, which significantly facilitated operation of the device. Tests of the reflow oven confirmed relevance of the design assumptions and high quality of the product.