3D capacitive transmission of analog signals with automatic compensation of the voltage attenuation

E. Franchi, F. Natali, A. Gnudi, R. Guerrieri, M. Innocenti, L. Ciccarelli, M. Scandiuzzo, R. Canegallo
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引用次数: 3

Abstract

An architecture to compensate the voltage attenuation introduced by 3D capacitive coupling is proposed. The scheme is applied to the design of a prototype aimed at demonstrating that 3D technology based on capacitive coupling allows to transmit analog signals as well as digital ones. The scheme is based on a calibration channel which sets the gain of the variable gain amplifiers of signal channels in order to compensate for the voltage attenuation. The prototype is designed in CMOS 90 nm technology. 3D assembling is done at die level using a face to face stacking procedure. Each channel has an area 90x30 µm2 and a power consumption of 1 mW. A gain error within 10% with respect to the nominal value has been measured for a signal amplitude varying from 200 mV to 1 V in the 100 KHz to 20 MHz range.
三维电容传输模拟信号,具有电压衰减自动补偿功能
提出了一种补偿三维电容耦合引起的电压衰减的结构。该方案应用于一个原型的设计,旨在证明基于电容耦合的三维技术可以传输模拟信号和数字信号。该方案基于一个校准通道,该通道设置信号通道的变增益放大器的增益,以补偿电压衰减。原型机采用CMOS 90纳米技术设计。3D组装是在模具水平上使用面对面堆叠程序完成的。每个通道的面积为90x30µm2,功耗为1mw。在100 KHz至20 MHz范围内,对200 mV至1 V的信号幅度进行了测量,相对于标称值的增益误差在10%以内。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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