High-voltage and power integrated circuits: switch topology, application and technology

Abstract

The partitioning of an intelligent-power electronic system into one or more semiconductor components is both application and technology specific. Overall system cost, chip area and packaging considerations along with power, on-resistance, off-state blocking capabiliv, speed and switch-load topology determine the technical and economic fern-bility of a given technology and partitioning approach. Emerging trends in the use of self-isolated, conventional and RESURF junction-isolated, and dielectrically-isolatedprocess technologies needed to .address applications employing low-side switch topologies for single-quadrant power converters, LV pushpull topologies for disk drives, monolithic HV PIP topologies for display driven, multichip HV PIP topologies comn to off-line motor control, and high-side switch topologies used in automotive electronics are detailed.