Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Huang, W. Chiu, A. Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, B. Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, G. Dehng
{"title":"RFIC and RF Module for 5G Applications","authors":"Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Huang, W. Chiu, A. Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, B. Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, G. Dehng","doi":"10.1109/VLSI-DAT49148.2020.9196407","DOIUrl":null,"url":null,"abstract":"In this work, a 12nm CMOS 2/3/4/5G multi-RAT (Radio Access Technology) XCVR is presented, capable of supporting up to 6 inter-band CA DL with flexible 4x4 MIMO port selection and 2 inter-band CA UL with coherent 2x2 MIMO. In NR 200MHz 4x4 MIMO 256QAM mode a throughput up to 5Gbps can be achieved. This work is housed in 2-layer Flip-Chip Chip-Scale Package (FCCSP).","PeriodicalId":235460,"journal":{"name":"2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-DAT49148.2020.9196407","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, a 12nm CMOS 2/3/4/5G multi-RAT (Radio Access Technology) XCVR is presented, capable of supporting up to 6 inter-band CA DL with flexible 4x4 MIMO port selection and 2 inter-band CA UL with coherent 2x2 MIMO. In NR 200MHz 4x4 MIMO 256QAM mode a throughput up to 5Gbps can be achieved. This work is housed in 2-layer Flip-Chip Chip-Scale Package (FCCSP).