Current benchmarking results of EUV resist at Selete

Lithography Asia Pub Date : 2008-12-04 DOI:10.1117/12.804665
D. Kawamura, K. Kaneyama, Shinji Kobayashi, H. Oizumi, T. Itani
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引用次数: 13

Abstract

The main challenge facing the implementation of EUV resist and processing has been concurrent achievement of high sensitivity, high resolution, and low line width roughness (LWR). In order to improve the performance of EUV resist, Selete is actively pursuing its benchmarking. The results from this benchmarking were found to be as follows: Esize improved with the increasing capability of EUV pattern exposure. Sensitivity improved during this year. Resolution is found to be almost sufficient for 32-nm half-pitch (hp), but not quite good enough for 22-nm hp. Resist blur of the resist, which marked good score in benchmarking, is found to be 10nm to 11nm. LWR is still far from its target value.
Selete的EUV电阻的当前基准测试结果
实现极紫外光刻阻和处理所面临的主要挑战是同时实现高灵敏度、高分辨率和低线宽粗糙度(LWR)。为了提高EUV电阻的性能,Selete正在积极追求其基准测试。该基准测试的结果如下:尺寸随着EUV模式曝光能力的增加而提高。灵敏度在这一年中有所提高。对于32nm半间距(hp),分辨率几乎足够,但对于22nm hp则不够好。在基准测试中取得好成绩的抗蚀剂的抗蚀模糊在10nm到11nm之间。LWR距离目标值还很远。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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