Monolithic fabrication of a planar Gunn diode and a pHEMT side-by-side

V. Papageorgiou, A. Khalid, M. Steer, Chong Li, D. Cumming
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引用次数: 3

Abstract

This work presents the implementation of planar Gunn diodes and pseudomorphic high electron mobility transistors (pHEMTs) on the same wafer for the first time. The AlGaAs/InGaAs/GaAs heterostructures were designed for the realisation of pHEMTs on a Gallium Arsenide - based wafer. T-gate technology has been used for the maximisation of the transistor performance. Devices with a 70 nm long gate foot showed excellent DC and small-signal characteristics, with 780 mS/mm peak transconductance and 200 GHz fmax. Planar Gunn diodes were fabricated in parallel with the pHEMTs, sharing most of the fabrication steps. The diodes produce oscillations with 87.6 GHz maximum frequency and -40 dBm maximum output power.
平面Gunn二极管和pHEMT并排的单片制造
本文首次在同一晶圆上实现了平面Gunn二极管和伪晶高电子迁移率晶体管(phemt)。设计了用于在砷化镓晶圆上实现pHEMTs的AlGaAs/InGaAs/GaAs异质结构。t栅极技术已被用于晶体管性能的最大化。采用70 nm长栅极脚的器件具有良好的直流和小信号特性,峰值跨导率为780 mS/mm, fmax为200 GHz。平面Gunn二极管与phemt并行制造,共享大部分制造步骤。二极管产生振荡,最大频率为87.6 GHz,最大输出功率为-40 dBm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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