Low threshold current vertical-cavity surface-emitting lasers with enhanced resistance to heating

G. Yang, M. MacDougal, P. Dapkus
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Abstract

Vertical-cavity surface-emitting lasers (VCSEL's) fabricated by selective oxidation are attractive to achieve ultralow threshold currents [1-3]. Efficient heat dissipation, along with low threshold, is critical for uses as optical interconnects where massive integration is required. In this paper, we report an ultralow threshold of 8.7 µA and a high output power over 1.9 mW in single quantum well VCSEL's fabricated by selective oxidation from an all epitaxial structure with intracavity p-contact layers grown by metalorganic chemical vapor deposition. The design of this structure is optimized for low thermal resistance by using distributed Bragg reflectors (DBR's) composed completely of binary materials. Fig.l shows a schematic cross-section of the fabricated VCSEL's. The epitaxial structure consists of a 30-pair n-doped AlAs/GaAs quarter-wave stacks, an Al0.22Ga0.78As/GaAs/In0.2Ga0.8As resonant λ-cavity, p-doped contact layers, and a 22-pair undoped AlAs/GaAs quarter-wave stacks. The p-doped contact layers are formed from a 0.25 λ AlAs current constriction layer and a 0.75 λ GaAs intracavity contact layer. After growth, the top DBR is selectively wet etched into 14 and 5 µm square mesas down to the p-type GaAs contact layer. Then, 50 µm square mesas, whose centers coincide with the centers of the top mesas, are formed by wet chemical etching. Current flow apertures of 10 and ~3 µm are formed below the 14 and 5 µm square top mirrors, respectively, by selective oxidation.
具有增强的耐热性的低阈值电流垂直腔表面发射激光器
通过选择性氧化制备的垂直腔面发射激光器(VCSEL’s)在实现超低阈值电流方面具有吸引力[1-3]。高效的散热和低阈值对于需要大规模集成的光互连至关重要。在本文中,我们报道了由金属有机化学气相沉积生长的腔内p接触层的全外延结构通过选择性氧化制备的单量子阱VCSEL的超低阈值为8.7µA,输出功率超过1.9 mW。采用完全由二元材料组成的分布式布拉格反射器(DBR's),优化了该结构的低热阻设计。图1为制备的VCSEL的截面示意图。外延结构由30对n掺杂的AlAs/GaAs四分之一波堆叠、Al0.22Ga0.78As/GaAs/In0.2Ga0.8As谐振腔、p掺杂的接触层和22对未掺杂的AlAs/GaAs四分之一波堆叠组成。p掺杂的接触层由0.25 λ的AlAs电流收缩层和0.75 λ的GaAs腔内接触层组成。生长后,顶部DBR被选择性地湿蚀刻成14和5µm正方形的台面,直至p型GaAs接触层。然后,用湿法化学蚀刻形成50µm的正方形台面,其中心与顶部台面的中心重合。通过选择性氧化,在14µm和5µm的方形顶镜下方分别形成了10µm和~3µm的电流孔。
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