Doping of GaN grown on silicon via ion implantation

F. Mazen, M. Coig, A. Lardeau-Falcy, L. Amichi, M. Veillerot, C. Licitra, A. Grenier, J. Biscarrat, J. Kanyandekwe, M. Charles, F. Milési
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引用次数: 1

Abstract

Since the last decade, power electronics is moving towards higher frequency and higher voltage applications. For this purpose, the use of silicon (Si) presents some limitations and new materials like Silicon Carbide (SiC) or more recently Gallium Nitride (GaN) have boomed. Because of its large bandgap and high breakdown voltage, GaN is a good candidate for high power device applications, as well as Radio Frequency (RF).
离子注入法在硅上生长GaN的掺杂研究
自过去十年以来,电力电子技术正朝着更高频率和更高电压的应用方向发展。为此,硅(Si)的使用存在一些局限性,并且像碳化硅(SiC)或最近的氮化镓(GaN)这样的新材料蓬勃发展。由于其大带隙和高击穿电压,氮化镓是高功率器件应用以及射频(RF)的良好候选者。
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