Ni Diffusion Behavior and Bondability of Electroless NiP/PdP/Au Film

Abstract

The Ni diffusion behavior of electroless NiP/PdP/Au film was investigated using Auger electron spectroscopy in this study. The diffusion coefficient of Ni in PdP was estimated from concentration profile by Einstein-Smoluchowski equation and Boltzman-Matano method. The obtained value was 3.5 ~4.7⨯10–20 m2s-1at 553 K. Furthermore, the bondability of the NiP/PdP/Au film before and after heat treatment was also studies to clarify the bonding reliability of the film of various thickness. Thicker NiP/PdP/Au film condition achieved high bonding reliability at least under the condition of this study.