{"title":"Demonstrating the potential of 6h-silicon carbide for power devices","authors":"J. Palmour, J. Edmond, C. Carter","doi":"10.1109/DRC.1993.1009604","DOIUrl":null,"url":null,"abstract":"Summary form only given. Discusses the first vertical UMOS power MOSFETs ever reported in SiC, shows the highest gain 6H-SiC BJTs (bipolar junction transistors) and thyristors ever reported, and demonstrate the high-temperature operation of these devices. Vertical power MOSFETs fabricated in 6H-SiC with a UMOS design have specific on-resistances as low as 38 m Omega -cm/sup 2/ at a gate bias of +12 V. These devices can have current densities as high as 190 A/cm/sup 2/ (0.32 A/cm of gate periphery) and can dissipate a maximum power density of 5.4 kW/cm/sup 2/. SiC BJTs have been demonstrated up to 400 degrees C. The device structure used a reactive ion etched emitter with sintered Ni contacts to both the emitter and collector, and Al/Ti alloy contacts to the base. Four-layer structures have also been demonstrated in 6H-SiC, with p-n-p-n thyristors showing 100 V operation. >","PeriodicalId":310841,"journal":{"name":"51st Annual Device Research Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"51st Annual Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.1993.1009604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
Summary form only given. Discusses the first vertical UMOS power MOSFETs ever reported in SiC, shows the highest gain 6H-SiC BJTs (bipolar junction transistors) and thyristors ever reported, and demonstrate the high-temperature operation of these devices. Vertical power MOSFETs fabricated in 6H-SiC with a UMOS design have specific on-resistances as low as 38 m Omega -cm/sup 2/ at a gate bias of +12 V. These devices can have current densities as high as 190 A/cm/sup 2/ (0.32 A/cm of gate periphery) and can dissipate a maximum power density of 5.4 kW/cm/sup 2/. SiC BJTs have been demonstrated up to 400 degrees C. The device structure used a reactive ion etched emitter with sintered Ni contacts to both the emitter and collector, and Al/Ti alloy contacts to the base. Four-layer structures have also been demonstrated in 6H-SiC, with p-n-p-n thyristors showing 100 V operation. >