A Learning-Based Thermal Simulation Framework for Emerging Two-Phase Cooling Technologies

Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Zhengmao Lu, E. Wang, S. Reda, A. Coskun
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引用次数: 2

Abstract

Future high-performance chips will require new cooling technologies that can extract heat efficiently. Two-phase cooling is a promising processor cooling solution owing to its high heat transfer rate and potential benefits in cooling power. Two-phase cooling mechanisms, including microchannel-based two-phase cooling or two-phase vapor chambers (VCs), are typically modeled by computing the temperature-dependent heat transfer coefficient (HTC) of the evaporator or coolant using an iterative simulation framework. Precomputed HTC correlations are specific to a given cooling system design and cannot be applied to even the same cooling technology with different cooling parameters (such as different geometries). Another challenge is that HTC correlations are typically calculated with computational fluid dynamics (CFD) tools, which induce long design and simulation times. This paper introduces a learning-based temperature-dependent HTC simulation framework that is used to model a two-phase cooling solution with a wide range of cooling design parameters. In particular, the proposed framework includes a compact thermal model (CTM) of two-phase VCs with hybrid wick evaporators (of nanoporous membrane and microchannels). We build a new simulation tool to integrate the proposed simulation framework and CTM. We validate the proposed simulation framework as well as the new CTM through comparisons against a CFD model. Our simulation framework and CTM achieve a speedup of 21 × with an average error of 0.98° C (and a maximum error of 2.59° C). We design an optimization flow for hybrid wicks to select the most beneficial hybrid wick geometries. Our flow is capable of finding a geometry- coolant combination that results in a lower (or similar) maximum chip temperature compared to that of the best coolant-geometry pair selected by grid search, while providing a speedup of 9.4 x.
新兴两相冷却技术的基于学习的热模拟框架
未来的高性能芯片将需要新的冷却技术来有效地提取热量。两相冷却是一种很有前途的处理器冷却解决方案,因为它具有高的传热率和冷却功率的潜在优势。两相冷却机制,包括基于微通道的两相冷却或两相蒸汽室(VCs),通常通过使用迭代模拟框架计算蒸发器或冷却剂的温度相关传热系数(HTC)来建模。预先计算的HTC相关性是特定于给定的冷却系统设计的,甚至不能应用于具有不同冷却参数的相同冷却技术(例如不同的几何形状)。另一个挑战是HTC相关性通常是用计算流体动力学(CFD)工具计算的,这会导致较长的设计和模拟时间。本文介绍了一个基于学习的温度依赖HTC仿真框架,用于模拟具有广泛冷却设计参数的两相冷却解决方案。特别地,提出的框架包括一个紧凑的两相VCs与混合芯蒸发器(纳米多孔膜和微通道)的热模型(CTM)。我们构建了一个新的仿真工具来集成所提出的仿真框架和CTM。我们通过与CFD模型的比较验证了所提出的仿真框架以及新的CTM。我们的仿真框架和CTM实现了21倍的加速,平均误差为0.98°C(最大误差为2.59°C)。我们设计了混合芯的优化流程,以选择最有利的混合芯几何形状。我们的流程能够找到一种几何形状-冷却剂组合,与网格搜索选择的最佳冷却剂-几何形状组合相比,该组合的最大芯片温度更低(或相似),同时提供9.4倍的加速。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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