Design and development of compact CDMA/WCDMA power amplifier module for high yield low cost manufacturing

Abstract

A low cost compact (3 mm /spl times/ 3 mm) internally matched CDMA/WCDMA power amplifier module is designed with high-density-interconnection (HDI) laminate technology. Design methodologies for the power amplifier module are presented. Some advances in wafer processing technology are discussed. The PCS/IMT dual band WCDMA power amplifier achieves a typical 40% power-added-efficiency (PAE) at 27.5 dBm along with a -40 dBc linearity at 5 MHz offset frequency. At a low operating power of 16 dBm, 22% PAE can be achieved at V/sub cc/ = 1.5 V. Manufacturing yield issues are discussed as well.