A Study of the CMOS Image Sensor Semiconductor Business: Factors Maintaining the Long- Term Manufacturing Technology Superiority of IDM Companies

T. Asami, Masaharu Tsujimoto
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Abstract

In recent years, semiconductor products have become increasingly important as essential parts of numerous technological devices. In addition, competition is becoming increasingly fierce. Currently, many semiconductor businesses have a horizontal specialization business structure. However, in the CMOS image sensor (CIS) business, vertically Integrated Device Manufacturer (IDM) companies are leading businesses possessing significant technological advantages. This study applies Baldwin's (2004) functional module analysis method to clarify how IDM companies maintain their superiority in CIS, and examines in particular their knowledge acquisition method for improving the main characteristics of CIS. The basic questions this study addresses are why the CIS business has been able to promote the business of IDM companies, and why has it maintained its advantage over the last 10 years. This study seeks to examine this question and present the mechanism behind its superiority. First, the modules of CIS products and development task flow are separated into modules by function and analyzed. The sensor core and system core require different design capabilities. The photodiode of the sensor core is designed through a combination and application of semiconductor physics and optical knowledge by highly expert design, device physics, and process engineers. In IDM companies, development is accomplished in a complementary manner with mutually integrated technologies. We note particularly that the boundary between companies in the horizontal specialization business in the sensor core design affects technological improvement and the speed of growth. During the heyday of SoC in 1990, technology was transferred and production outsourced from the world's top-class IDM to foundries. Based on the current situation two decades later, we analyzed the behavior at that time by back-casting and extracted five growth factors. Five growth opportunities for latecomers to the high-tech manufacturing industry were factors in the current implementation status and effects of the CIS business.
CMOS图像传感器半导体业务研究:维持IDM公司长期制造技术优势的因素
近年来,半导体产品作为许多技术设备的重要组成部分变得越来越重要。此外,竞争也越来越激烈。目前,许多半导体企业都是横向专业化的业务结构。然而,在CMOS图像传感器(CIS)业务中,垂直集成器件制造商(IDM)公司是拥有显著技术优势的领先企业。本研究运用Baldwin(2004)的功能模块分析方法来阐明IDM公司如何保持其在CIS方面的优势,并特别考察了他们改善CIS主要特征的知识获取方法。本研究解决的基本问题是,为什么CIS业务能够促进IDM公司的业务,以及为什么它在过去10年里保持了优势。本研究试图检验这个问题,并提出其优势背后的机制。首先,将CIS产品模块和开发任务流程按功能划分为模块并进行分析。传感器核心和系统核心需要不同的设计能力。传感器核心的光电二极管是由高度专业的设计,器件物理和工艺工程师通过半导体物理和光学知识的结合和应用而设计的。在IDM公司中,开发是通过相互集成的技术以互补的方式完成的。我们特别注意到,在传感器核心设计的横向专业化业务中,公司之间的边界影响着技术改进和增长速度。在1990年SoC的全盛时期,技术转移和生产外包从世界一流的IDM到代工厂。基于二十年后的现状,我们用回溯法分析了当时的行为,提取了五个生长因子。高科技制造业后来者的五个增长机会是影响CIS业务当前实施状态和效果的因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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