OMEGAPIX2: 3D integrated circuit prototype dedicated to the ATLAS pixel detector for the High Luminosity LHC

J. Genat, O. Le Dortz, A. Lounis, G. Martin-Chassard, J. Tongbong, D. Thienpont
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引用次数: 5

Abstract

The OMEGAPIX2 chip embeds a matrix of channels implemented in two vertically integrated (3D) circuits and designed to read out a matrix of 96×24 plannar pixels. The form factor of each pixel is 35×200 μm. The first 3D devices's layer includes the analogue part of the channel processing, it will be bounded to the sensor by connecting the channel inputs and the sensors pixels by the Through Silicon Vias (TSV); the other layer performs the digital memorization of each events and manages the sorting of good events after the Level 1 (L1) trigger acquisition. In this paper, the 3D technology is briefly described, some design considerations are discussed and some typical simulations are shown. The circuit has been submitted in October 2011 and is waited to be received in December 2012.
OMEGAPIX2:用于高亮度LHC的ATLAS像素探测器的3D集成电路原型
OMEGAPIX2芯片嵌入了一个通道矩阵,实现在两个垂直集成(3D)电路中,设计用于读取96×24平面像素矩阵。每个像素的外形尺寸为35×200 μm。第一个3D设备层包括通道处理的模拟部分,它将通过通过硅通孔(TSV)连接通道输入和传感器像素,从而限定到传感器;另一层执行每个事件的数字记忆,并在第1级(L1)触发获取后管理好事件的排序。本文简要介绍了三维技术,讨论了一些设计注意事项,并给出了一些典型的仿真结果。该电路已于2011年10月提交,等待2012年12月收到。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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