Manufacturing application study of CdZnTe wafers using automated X-ray metrology

Abstract

Digital X-ray diffraction imaging (XRDI) and high-resolution X-ray diffraction (HRXRD) are used to analyse defects in a non-destructive way on commercially made (111) CdZnTe substrates. The X-ray tools automatically aligned, measured and analysed the samples. The XRDI images show clear differences between the CdZnTe substrates which correspond to high and low yield. HRXRD rocking curve data correlates with the presence of the defects seen in XRDI images. These results suggest that X-ray metrology is an essential tool for the production monitoring of CdZnTe substrates in an automated environment.