Microvia technology in MCM-D/L-need, challenge, and response

Abstract

This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented.