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Junction-Less Stackable SONOS Memory Realized on Vertical-Si-Nanowire for 3-D Application

2011 3rd IEEE International Memory Workshop (IMW) Pub Date : 2011-04-25 DOI:10.1109/VTSA.2011.5872271
Y. Sun, H. Y. Yu, N. Singh, E. Gnani, G. Baccarani, K. Leong, G. Lo, D. Kwong
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引用次数: 4

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基于垂直硅纳米线的无结可堆叠SONOS存储器的三维应用
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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2011 3rd IEEE International Memory Workshop (IMW)
2011 3rd IEEE International Memory Workshop (IMW)
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