Elements of low power design for integrated systems

S. Kang
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引用次数: 32

Abstract

The increasing prominence of portable systems and the need to limit power consumption and hence, heat dissipation in very high density VLSI chips have led to rapid and innovative developments in low power design recently. Leakage control is becoming critically important for deep sub-100 nm technologies due to the scaling down of threshold voltage and gate oxide thickness of transistors. In this paper, we discuss major sources of power dissipation in VLSI systems, and various low power design techniques on the technology and circuit level, logic level, and system level.
集成系统的低功耗设计要素
便携式系统的日益突出和限制功耗的需要,因此,非常高密度VLSI芯片的散热导致了低功耗设计的快速创新发展。由于晶体管的阈值电压和栅极氧化物厚度的减小,漏电控制对于深度低于100纳米的技术变得至关重要。在本文中,我们讨论了VLSI系统的主要功耗来源,以及各种低功耗设计技术,包括技术和电路级,逻辑级和系统级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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