Low Cost MMIC Insertion Using Thick Film Processing

A. Bettner, B. Hundley, P. Salisbury
{"title":"Low Cost MMIC Insertion Using Thick Film Processing","authors":"A. Bettner, B. Hundley, P. Salisbury","doi":"10.1109/MCS.1987.1114532","DOIUrl":null,"url":null,"abstract":"Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.","PeriodicalId":231710,"journal":{"name":"Microwave and Millimeter-Wave Monolithic Circuits","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microwave and Millimeter-Wave Monolithic Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCS.1987.1114532","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
使用厚膜加工的低成本MMIC插入
多层厚膜电路已经被开发出来,为MMIC芯片提供单电源偏置和无功匹配。其结果是一种以极低成本获得大量增益的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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