N. Dikhaminjia, J. He, M. Tsiklauri, J. Drewniak, J. Fan, A. Chada, B. Mutnury, B. Achkir
{"title":"PAM4 signaling considerations for high-speed serial links","authors":"N. Dikhaminjia, J. He, M. Tsiklauri, J. Drewniak, J. Fan, A. Chada, B. Mutnury, B. Achkir","doi":"10.1109/ISEMC.2016.7571771","DOIUrl":null,"url":null,"abstract":"The paper discusses current challenges and advantages of multi-level signaling for high-speed serial links, showing the differences and similarities in link-path analysis between binary and multi-level signaling. Comparison of two signaling methodologies is given from the general theory viewpoint, as well as on the basis of various tests regarding crosstalk, jitter, equalizations and different channel characteristics, such as material, impedance and overall manufacturing design sensitivity.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"16 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2016.7571771","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11
Abstract
The paper discusses current challenges and advantages of multi-level signaling for high-speed serial links, showing the differences and similarities in link-path analysis between binary and multi-level signaling. Comparison of two signaling methodologies is given from the general theory viewpoint, as well as on the basis of various tests regarding crosstalk, jitter, equalizations and different channel characteristics, such as material, impedance and overall manufacturing design sensitivity.