M. Janicki, L. Starzak, T. Torzewicz, K. Górecki, Przemysław Ptak
{"title":"Thermal Characterisation of Colour Power LEDs","authors":"M. Janicki, L. Starzak, T. Torzewicz, K. Górecki, Przemysław Ptak","doi":"10.23919/MIXDES.2019.8787189","DOIUrl":null,"url":null,"abstract":"This paper presents the results of investigations obtained for colour power LEDS. In particular, electrical optical and thermal performance of these devices is studied. First, the entire measurement methodology and the experimental set-ups are introduced in detail. Then, the measurement results obtained for selected power LEDs operating in different cooling conditions are provided. Finally, the thermal properties of considered devices are discussed comprehensively. For all thermal analyses presented throughout this paper the Network Identification by Deconvolution method is employed.","PeriodicalId":309822,"journal":{"name":"2019 MIXDES - 26th International Conference \"Mixed Design of Integrated Circuits and Systems\"","volume":"239 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 MIXDES - 26th International Conference \"Mixed Design of Integrated Circuits and Systems\"","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MIXDES.2019.8787189","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper presents the results of investigations obtained for colour power LEDS. In particular, electrical optical and thermal performance of these devices is studied. First, the entire measurement methodology and the experimental set-ups are introduced in detail. Then, the measurement results obtained for selected power LEDs operating in different cooling conditions are provided. Finally, the thermal properties of considered devices are discussed comprehensively. For all thermal analyses presented throughout this paper the Network Identification by Deconvolution method is employed.