TCAD simulation vs. experimental results in FDSOI technology: From advanced mobility modeling to 6T-SRAM cell characteristics prediction

M. Jaud, P. Scheiblin, S. Martinie, M. Cassé, O. Rozeau, J. Dura, J. Mazurier, A. Toffoli, O. Thomas, F. Andrieu, O. Weber
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引用次数: 6

Abstract

We present TCAD simulations based on advanced mobility modeling including Surface Roughness (SR) and Remote Coulomb Scattering (RCS) effects, quantum correction and short channel effects. From these calibrated models, FDSOI 6T-SRAM cells are simulated and compared to experimental data. The very good agreement achieved between simulations and electrical data on both mobility and electrical figures of merit (device and SRAM) offers major opportunities for predictive design based on TCAD simulations.
FDSOI技术中的TCAD仿真与实验结果:从先进的移动性建模到6T-SRAM单元特性预测
我们提出了基于先进迁移率模型的TCAD仿真,包括表面粗糙度(SR)和远程库仑散射(RCS)效应、量子校正和短通道效应。根据这些校准模型,对FDSOI 6T-SRAM电池进行了模拟,并与实验数据进行了比较。在移动性和电气性能指标(器件和SRAM)方面,仿真和电气数据之间取得了非常好的一致性,为基于TCAD仿真的预测设计提供了重要机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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