Packaging and thermomechanical challenges for high temperature electronics

Abstract

Summary form only given. The development of new solutions for high temperature applications in the field of automotive electronics has become very important in recent years. However, it has been known to constitute a very complicated area of research. Serious troubles are connected with the thermal misfit problems. In electronic packaging for automotive electronics, various problems have to be solved. Due to the thermomechanical behaviour of solder joints, new packaging strategies are required (e.g. chip scale package, /spl mu/BGA and flip chip interconnection). The classical tin-lead solders have to be removed. Another problem is the "polymeric material problem". The creep behaviour in high temperature regions leads to a very complicated material behaviour which required new steps for advanced measures in the design and testing processes. The authors present their experience in the field of reliability analysis in automotive electronics and microsystems technology applications (e.g. airbag sensors) taking into account both simulation and experiments mainly in the field of automotive sensors and packaging for high temperature applications. In addition, the problem of CTE measurement by the new microDAC method in high temperature automotive electronics is discussed.