Potential of GaN vertical JFETs presented through a comprehensive discussion of dynamic performance compared to SiC JFETs

D. Ji, Wenwen Li, S. Chowdhury
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引用次数: 3

Abstract

In this paper, a comparative study on the switching characteristics and power losses in GaN and SiC vertical junction field effect transistors (VJFETs) is presented. Models of VJFETs based on GaN and SiC, were separately built in Sivaco ATLAS and applied to a mixedmode device/circuit simulator for dynamic evaluation under identical test conditions. The device figure of merit (RonQg) of GaN VJFET is 57% of that for SiC VJFET, showing significantly lower power loss. The switching loss of the GaN VJFET was found to be half that of the SiC device at 100 kHz. From the material point of view, GaN has similar breakdown electric field with SiC, however, the electron mobility in bulk GaN has been experimentally proven to be higher [1] than that in SiC. High mobility enables GaN devices to be operated at high frequency with remarkably lower switching loss.
通过对GaN垂直jfet与SiC垂直jfet动态性能的综合讨论,提出了GaN垂直jfet的潜力
本文对GaN和SiC垂直结场效应晶体管(vjfet)的开关特性和功率损耗进行了比较研究。在Sivaco ATLAS中分别建立了基于GaN和SiC的vjfet模型,并将其应用于混合模式器件/电路模拟器,在相同的测试条件下进行动态评估。GaN VJFET的器件性能值(RonQg)是SiC VJFET的57%,功率损耗明显降低。在100 kHz时,GaN VJFET的开关损耗是SiC器件的一半。从材料的角度来看,GaN与SiC具有相似的击穿电场,但实验证明,GaN中的电子迁移率比SiC中的高[1]。高迁移率使GaN器件能够在高频率下工作,并且开关损耗显著降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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