{"title":"SIMMWICs on Micromachined Silicon on Insulator Substrates Beyond 100 GHz","authors":"A. Muller, E. Kasper","doi":"10.1109/SMIC.2008.13","DOIUrl":null,"url":null,"abstract":"The realization of SIMMWICs (silicon millimeter-wave integrated circuits) for frequencies above 100 GHz is presented. Epitaxial layers grown with molecular beam epitaxy and low-loss microstrip lines allow the implementation of a variety of devices required for basic system-on-chip building blocks. The applied silicon technology using Al/AlNiSi contacts offers excellent integration possibilities. Schottky diodes are designed for Mott mode operation and feature cutoff-frequencies of more than 700 GHz. Substrate membranes with a thickness of 50 mum are created by applying a selective etching process using silicon on insulator (SOI) wafers. Different microstrip circuit designs demonstrate the integration potential. Finally, two singly balanced mixer designs with low LO-power drive demands and low conversion loss characteristics are exposed. We choose the 122 GHz ISM band as an example for the demonstration of the potential of this cost-effective integration approach.","PeriodicalId":350325,"journal":{"name":"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMIC.2008.13","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The realization of SIMMWICs (silicon millimeter-wave integrated circuits) for frequencies above 100 GHz is presented. Epitaxial layers grown with molecular beam epitaxy and low-loss microstrip lines allow the implementation of a variety of devices required for basic system-on-chip building blocks. The applied silicon technology using Al/AlNiSi contacts offers excellent integration possibilities. Schottky diodes are designed for Mott mode operation and feature cutoff-frequencies of more than 700 GHz. Substrate membranes with a thickness of 50 mum are created by applying a selective etching process using silicon on insulator (SOI) wafers. Different microstrip circuit designs demonstrate the integration potential. Finally, two singly balanced mixer designs with low LO-power drive demands and low conversion loss characteristics are exposed. We choose the 122 GHz ISM band as an example for the demonstration of the potential of this cost-effective integration approach.