Die Tilt Improvement Through Copper Spacers in Solder Paste Printing

Abstract

Solder paste is a susceptible material that requires extensive study to ensure meeting the desired manufacturability responses. The stencil printing process allowed a consistent amount of solder transfer onto a pad during the die attach process. Continuous development in solder application is done to ensure high-quality products are being produced. Critical responses such as maintaining uniform bond line thickness (BLT) and even die tilting have been the focus of this study. With available technologies in the market for die tilting improvement, this study focuses on exploring copper spacers technology in the solder paste printing material. Fillers are added into the paste which will serve as standoff and dictate the solder height underneath the die.