Transmission line models of multi-chip module interconnects

[1992] Proceedings. Fifth Annual IEEE International ASIC Conference and Exhibit Pub Date : 1992-09-21 DOI:10.1109/ASIC.1992.270246

G. R. Ellis, P. R. Mukund

引用次数: 0

Abstract

An overview of the important transmission line properties of circuit interconnects is given, and it is shown how these properties can affect the operation of high speed and high density multichip modules (MCMs). Both frequency and time domain issues are addressed. The effects of line-caused delay and signal noise on MCM layouts are reported.<>

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多芯片模块互连的传输线模型

概述了电路互连的重要传输线特性，并说明了这些特性如何影响高速高密度多芯片模块(mcm)的工作。频域和时域问题都得到了解决。报道了线路延迟和信号噪声对MCM布局的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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