{"title":"Thermal-resistance models for proton-isolated double-heterostructure lasers","authors":"D. Newman, D. Bond, J. Stefani","doi":"10.1049/IJ-SSED.1978.0007","DOIUrl":null,"url":null,"abstract":"Calculations of the thermal resistances of stripe-geometry double-heterostructure lasers are dependent on assumptions made concerning the positions of heat sources within the laser structures. The effect on thermal resistance of heat sources located at various levels in the multilayer structure are considered here. The calculations indicate that thermal resistances of proton-isolated structures can be approximately halved when energy is radiatively transferred from the device active region rather than when all heat is generated within the device active region. This should be taken into consideration when the experimental effectiveness of laser-dice-bonding technology is being evaluated.","PeriodicalId":127114,"journal":{"name":"Iee Journal on Solidstate and Electron Devices","volume":"398 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1978-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"43","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Iee Journal on Solidstate and Electron Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/IJ-SSED.1978.0007","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 43
Abstract
Calculations of the thermal resistances of stripe-geometry double-heterostructure lasers are dependent on assumptions made concerning the positions of heat sources within the laser structures. The effect on thermal resistance of heat sources located at various levels in the multilayer structure are considered here. The calculations indicate that thermal resistances of proton-isolated structures can be approximately halved when energy is radiatively transferred from the device active region rather than when all heat is generated within the device active region. This should be taken into consideration when the experimental effectiveness of laser-dice-bonding technology is being evaluated.