An Integrated Thermal Dissipation Micro Structure for 400Gbit/s Optical Module

Abstract

400Gbit/s optical module will soon be commercially deployed on a large scale due to the need for high capacity information transmission. It has much higher power density than that of 100Gbit/s and 40Gbit/s and therefore the thermal management still remains an obstacle. An integrated thermal dissipation micro structure (ITDMS) including μ-channel, μ-pool, graphene thermal pad with lateral and longitudinal transfer paths proposed and numerically validated for effective heat dissipation of CDFP optical modules.