Multilevel interconnect-driven floorplanner

Evangeline F. Y. Young, James Lau
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Abstract

As technology continues to scale down, the number of transistors on a chip has increased rapidly and interconnect delay has become a dominant factor of system performance. Scalability and routability are two major concerns in floorplanning. In this paper, we present a multilevel floorplanner that addresses these important issues: congestion estimation, buffer planning and scalability. Experimental results show that this integrated multilevel approach, not only can handle large size problems, but can also improve the routability of the solution significantly by considering the interconnect issues.
多层互连驱动的地板规划器
随着技术的不断缩小,芯片上晶体管的数量迅速增加,互连延迟已成为系统性能的主要因素。可扩展性和可路由性是平面图的两个主要关注点。在本文中,我们提出了一个多层地板规划器,解决了这些重要问题:拥塞估计,缓冲规划和可扩展性。实验结果表明,这种集成的多层方法不仅可以处理大规模问题,而且考虑到互连问题,可以显著提高解的可达性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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