Stress Analysis and Strength Evaluation of Single-Lap Band Adhesive Joints Subjected to External Bending Moments

J. Liu, T. Sawa
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引用次数: 20

Abstract

The stresses in single-lap band adhesive joints of similar adherends subjected to external bending moments are analyzed as a three-body contact problem by using a two-dimensional theory of elasticity (plain strain state). In the analysis, the upper and lower adherends and the adhesive bonds which are bonded at two regions are replaced by finite strips, respectively. In the numerical calculations, the effects of the ratio of Young’s moduli of the adherends to that of the adhesives, the ratio of the adherend thickness to that of the adhesive bonds and the ratio of the bonding length to the total lap length on the stress distributions at the interfaces are examined. A method for estimating the joint strength is proposed using the interface stress and strain obtained by the analysis. Experiments to measure strains and rupture strength are carried out. A fairly good agreement is found between the estimated and the experimental results. For verification of the analysis, a finite element analysis (FEA) is also conducted. The results show that the strength of a single-lap band adhesive joint is almost the same as that of a single-lap adhesive joint in which the two adherends are completely bonded at the interfaces. Thus, the single-lap band adhesive joints are shown to be useful in the design of single-lap joints.
外弯矩作用下单搭带粘接接头的应力分析及强度评价
采用二维弹性理论(平面应变状态),分析了受外部弯矩作用的单搭接带状粘接接头的应力。在分析中,分别用有限条代替上、下粘附层和两个区域的粘接层。在数值计算中,考察了黏着物的杨氏模量与黏着物的杨氏模量之比、黏着物厚度与黏着物厚度之比以及黏着物长度与搭接总长度之比对界面应力分布的影响。提出了一种利用分析得到的界面应力和应变估计接头强度的方法。进行了应变和断裂强度测量实验。计算结果与实验结果吻合较好。为了验证分析结果,还进行了有限元分析(FEA)。结果表明:单搭接带状粘接接头的强度与界面完全粘接的单搭接接头的强度基本相同;因此,单搭接带胶接头在单搭接接头的设计中是有用的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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