Analytical 2D-model of CMOS micromachined gas flow sensors

G. Wachutka, R. Lenggenhager, D. Moser, H. Baltes
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引用次数: 22

Abstract

An analytical 2D model for the theoretical treatment of thermoelectric or thermoresistive integrated gas flow sensors is presented. It allows a detailed understanding and quantitative description of the function of cantilever beam and microbridge sensor structures fabricated using standard CMOS technology followed by an additional etching step. The heat exchange between the solid and the ambient gas along the surface of the respective sensor element is described by a generalized heat transport equation for the spatial temperature distribution. Only a small portion of the Joule heat produced by the integrated heating resistors is transferred to the gas, while the main stream of heat is conducted through the sandwich structure to the bulk silicon. However, there is a significant temperature modulation in the vicinity of the sensor surface, and it is this effect which makes the sensor work. In spite of the simplifying assumptions made, the model reproduces all essential features of the experimental findings and thus may be used to optimize the sensor design.<>
CMOS微加工气体流量传感器解析二维模型
提出了热电或热阻集成气体流量传感器理论处理的二维解析模型。它允许对使用标准CMOS技术制造的悬臂梁和微桥传感器结构的功能进行详细的理解和定量描述,然后进行额外的蚀刻步骤。固体和环境气体沿各自传感器元件表面的热交换用空间温度分布的广义热传递方程来描述。集成加热电阻产生的焦耳热量只有一小部分传递给气体,而主要的热量通过夹层结构传导到大块硅。然而,在传感器表面附近存在显著的温度调制,正是这种效应使传感器工作。尽管做出了简化的假设,但该模型再现了实验结果的所有基本特征,因此可用于优化传感器设计。
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