Field-based design of a new high pincount board connector for high data rate transmission

Abstract

We present the results of a field-based 3D time domain simulation of a new board connector. The connector is a high pincount SpeedPac(R) connector with four rows providing 136 high frequency twinax chambers per 100 mm. The results of the field simulation are the near- and far-end crosstalk, the reflection and transmission characteristics in the time and frequency domain. For the field simulation we use the program package MAFIA(R), which is based on the Finite-Integration-Technique (FIT). We also present results obtained from a reliable SPICE model of the SpeedPac(R) connector. By means of typical measurements and simulation results the reliability of the SPICE(R)-Model is demonstrated. All important electrical characteristics of the connector can be simulated by the SPICE(R)-Model. The comparison between the field simulation, the SPICE(R)-simulation and measurement is very good up to a limit of f=4 GHz and risetimes of tr>50 ps.