LDD structure influence on n-MOSFET parameters

G. Chiranu, F. Babarada
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引用次数: 3

Abstract

In this paper, we present the implications that the Lightly Doped Drain-LDD technique used for Metal Oxide Semiconductor-MOS fabrication of n-channel transistor has on different device parameters. The discussion focuses on the influence of the n- doping of drain, respectively source on the electric field, one of the most important issues of today's technology, but takes also into consideration another aspects such as the impact of LDD on series resistance of the device and channel length contribution on breakdown voltage reduction when considering drain/source light doping.
LDD结构对n-MOSFET参数的影响
在本文中,我们提出了用于金属氧化物半导体- mos晶体管制造的轻掺杂漏极- ldd技术对不同器件参数的影响。讨论的重点是漏极和源极的n掺杂对电场的影响,这是当今技术中最重要的问题之一,但在考虑漏极和源极掺杂时,还考虑了LDD对器件串联电阻的影响以及通道长度对击穿电压降低的贡献等其他方面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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