Characterization of the mechanical behavior of a Printed Circuit Board (PCB)

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI:10.1109/EuroSimE52062.2021.9410852

A. Atintoh, W. Kpobie, N. Bonfoh, M. Fendler, F. Addiego, P. Lipinski

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引用次数: 2

Abstract

The present study deals with a characterization of the anisotropic mechanical behavior of Printed Circuit Board (PCB) through an inverse method combining experiments and numerical simulations. The considered PCB is a woven laminate composite that consists of glass fiber reinforced epoxy matrix (FR4) and copper traces. Prior to numerical simulations, some simple mechanical tests were conducted in order to characterize the mechanical behavior of layers of FR4 and the corresponding PCB. Then, through a multiscale homogenization approach, unknown elastic properties of the PCB have been estimated by comparison with experimental results. This numerical homogenization was performed by the means of the Mechanics of Structure Genome (MSG) methodology. The main advantage of this MSG-based model is its ability to simultaneously estimate all the independent components of the tensor of elastic constants through only one computation, with a relatively low CPU time.

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印刷电路板(PCB)力学性能的表征

本文采用实验与数值模拟相结合的逆方法研究了印刷电路板(PCB)的各向异性力学行为。所考虑的PCB是一种编织层压复合材料，由玻璃纤维增强环氧基(FR4)和铜迹组成。在数值模拟之前，进行了一些简单的力学试验，以表征FR4层和相应PCB的力学行为。然后，通过多尺度均匀化方法，通过与实验结果的比较，估计了PCB的未知弹性性能。这种数值均匀化是通过结构基因组力学(MSG)方法进行的。这种基于msg的模型的主要优点是它能够通过一次计算同时估计弹性常数张量的所有独立分量，并且CPU时间相对较低。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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