Impact of Gaussian Grain Boundary Trap States on the Performance of the LTPS TFTs

Saurabh Jaiswal, M. K. Singh, Rupam Gosawmi, M. Goswami, Kavindra Kandpal
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Abstract

This paper presents a study on the impact of grain boundary trap states on the performance of polysilicon thin-film transistors (TFTs. It uses the Synopsys TCAD tool to analyze the device behavior of low-temperature polysilicon (LTPS) TFTs. It has been observed that grain boundary traps in polycrystalline material adversely impact the threshold voltage, subthreshold slope, and mobility. Across the grain boundaries, the primary transport mechanism is thermionic emission and it limits the carrier mobility and carrier concentration. Moreover, it was found that the influence of grain boundary traps was less in TFTs employing high-κ gate dielectrics. With HfO2 gate dielectric the simulated device exhibited the least threshold voltage of 0.85 V, the least subthreshold slope of 80 mV/decade, the highest field-effect mobility of 41 cm2/V-s, and a best on-to-off current ratio of 1.93x108 compared to the TFTs with SiO2 and Si3N4 gate dielectric.
高斯晶界阱态对LTPS tft性能的影响
本文研究了晶界阱态对多晶硅薄膜晶体管性能的影响。它使用Synopsys TCAD工具来分析低温多晶硅(LTPS) tft的器件行为。已经观察到晶界陷阱对多晶材料的阈值电压、阈下斜率和迁移率有不利影响。在晶界上,主要的输运机制是热离子发射,这限制了载流子迁移率和载流子浓度。此外,在采用高κ栅极电介质的tft中,晶界陷阱的影响较小。与使用SiO2和Si3N4栅极介质的晶体管相比,使用HfO2栅极介质的晶体管具有最小阈值电压0.85 V、最小亚阈值斜率80 mV/decade、最高场效应迁移率41 cm2/V-s和最佳通断电流比1.93x108。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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