Integration of BEoL Compatible 1T1C FeFET Memory Into an Established CMOS Technology

D. Lehninger, H. Mähne, T. Ali, R. Hoffmann, R. Olivo, M. Lederer, K. Mertens, T. Kämpfe, K. Biedermann, Matthias Landwehr, A. Heinig, Defu Wang, Yukai Shen, K. Bernert, S. Thiem, K. Seidel
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引用次数: 9

Abstract

Recently, hafnium oxide based ferroelectric memories gained great attention due to good scalability, high speed operation, and low power consumption. In contrast to the FRAM concept, the FeFET offers non-destructive read-out. However, the integration of the FeFET into an established CMOS technology entails several challenges. Herein, an 1T1C FeFET with separated transistor (1T) and ferroelectric capacitor (1C) is described and demonstrated. This alternative approach can be integrated into standard process technologies without introducing significant modifications of the front-end-of-line. All important steps starting from the integration of MFM devices into the BEoL through the fabrication and characterization of single 1T1C memory cells with various capacitor area ratios for bit cell tuning up to the initial demonstration of an 8 kbit test-array are covered.
将兼容BEoL的1T1C ffet存储器集成到已建立的CMOS技术中
近年来,基于氧化铪的铁电存储器因其良好的可扩展性、高速运行和低功耗而备受关注。与FRAM概念相反,ffet提供非破坏性读出。然而,将ffet集成到已建立的CMOS技术中需要几个挑战。本文描述并演示了一种具有分离晶体管(1T)和铁电电容器(1C)的1T1C场效应管。这种替代方法可以集成到标准工艺技术中,而无需对前端进行重大修改。涵盖了从MFM器件集成到BEoL的所有重要步骤,通过具有不同电容面积比的单个1T1C存储单元的制造和表征,用于位单元调谐,直至8 kbit测试阵列的初始演示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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