{"title":"Design Considerations for Digital Interconnects in Lossy Dielectric Medium","authors":"A. Agrawal","doi":"10.1109/ARFTG.1993.327025","DOIUrl":null,"url":null,"abstract":"The design considerations for high speed digital interconnects in a printed circuit board are presented. The frequency depepndent transmission line parameters and lossy dielectric medium are considered to characterize a transmission line. A study case is considered by presenting the design considerations for microstrip printed circuit line embedded in a homogeneous dielectric medium.","PeriodicalId":388026,"journal":{"name":"41st ARFTG Conference Digest","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"41st ARFTG Conference Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTG.1993.327025","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The design considerations for high speed digital interconnects in a printed circuit board are presented. The frequency depepndent transmission line parameters and lossy dielectric medium are considered to characterize a transmission line. A study case is considered by presenting the design considerations for microstrip printed circuit line embedded in a homogeneous dielectric medium.