Logic synthesis for manufacturability considering regularity and lithography printability

Lucas Machado, V. D. Bem, F. Moll, Sergio Gómez, R. Ribas, A. Reis
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引用次数: 2

Abstract

This paper presents a novel yield model for integrated circuits manufacturing, considering lithography printability problems as a source of yield loss. The use of regular layouts can improve the printability of IC layouts, but it results in a significant area overhead by introducing regularity. To the best of our knowledge, this is the first approach that considers the tradeoff of cells with different levels of regularity and different area overheads during the logic synthesis, in order to improve overall design yield. A technology remapping tool with such yield model as cost function is proposed and implemented and interesting results are presented.
考虑规则性和平版印刷性的可制造性逻辑综合
本文提出了一种新的集成电路制造良率模型,考虑了光刻印刷性问题作为良率损失的来源。规则布局的使用可以提高IC布局的可打印性,但由于引入规则,它会导致显著的面积开销。据我们所知,这是第一个在逻辑合成过程中考虑具有不同级别规则和不同面积开销的单元的权衡的方法,以提高整体设计产量。提出并实现了一种以成本函数为收益模型的技术重映射工具,并取得了令人感兴趣的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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