Characterization of Low-k SiOCH Layers in fine-pitch Cu-damascene interconnects by monoenergetic positron beams

A. Uedono, N. Inoue, Y. Hayashi, K. Eguchi, T. Nakamura, Y. Hirose, M. Yoshimaru, N. Oshima, T. Ohdaira, R. Suzuki
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Abstract

Pore characteristics of SiOCH layers in fine-pitch Cu-damascene interconnects were studied using monoenergetic positron beams. Doppler broadening spectra of the annihilation radiation and lifetime spectra of positrons were measured for the samples fabricated with the line/space widths of 0.27/0.27 and 1.08/1.08 µm, respectively. From measurements of the positronium (Ps) lifetimes, the mean pore size was estimated. The Ps intensity in SiOCH was found to be decreased by the scaling, which was attributed to the damage introduced during the damascene process.
用单能正电子束表征细间距Cu-damascene互连中的低k SiOCH层
利用单能正电子束流研究了细间距铜-砷互连中SiOCH层的孔隙特征。测量了线宽为0.27/0.27µm和线宽为1.08/1.08µm的样品的湮灭辐射的多普勒展宽光谱和正电子的寿命谱。通过对正电子离子(Ps)寿命的测量,估计了平均孔径。结果表明,结垢降低了SiOCH中Ps的强度,这是由于在大马士革过程中引入了损伤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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