Vertical band-to-band tunneling based non-volatile memory with high-K gate stack and stable hysteresis characteristics up to 400K

A. Biswas, Saurabh Tomar, A. Ionescu
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Abstract

This work reports for the first time the demonstration of non-volatile memory (NVM) cells using a Tunnel FETs (TFET) with high-k Al2O3/HfO2/Al2O3 dielectric stack and vertical tunneling. Vertical tunneling TFET devices are fabricated and characterized to evaluate their potential as low power memory operation. The memory cell can be programmed with voltages from -10V to -15V (p type) and show extremely stable memory hysteresis up to 106 program cycles with very low leakage. For the first time we experimentally show that, in strong contrast with FET-based NVM, the TFET memory window (VT shift) is highly stable with temperature up to 400K due to the specific band-to-band (BTB) conduction of TFETs.
基于垂直带对带隧道的非易失性存储器,具有高k栅极堆栈和高达400K的稳定迟滞特性
这项工作首次报道了使用具有高k Al2O3/HfO2/Al2O3介电层和垂直隧道的隧道场效应管(TFET)的非易失性存储器(NVM)电池的演示。垂直隧道ttfet器件的制造和表征,以评估其潜在的低功耗存储操作。存储单元可以在-10V到-15V (p型)的电压下编程,并且显示出极其稳定的存储滞后,高达106个程序周期,漏电非常低。我们首次通过实验证明,与基于fet的NVM形成强烈对比的是,由于TFET的特定带对带(BTB)传导,TFET记忆窗口(VT移位)在高达400K的温度下高度稳定。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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