Xiaowen Wu, Yaoyao Ye, Wei Zhang, Weichen Liu, M. Nikdast, Xuan Wang, Jiang Xu
{"title":"UNION: A unified inter/intra-chip optical network for chip multiprocessors","authors":"Xiaowen Wu, Yaoyao Ye, Wei Zhang, Weichen Liu, M. Nikdast, Xuan Wang, Jiang Xu","doi":"10.1109/NANOARCH.2010.5510930","DOIUrl":null,"url":null,"abstract":"As modern computing systems become increasingly complex, communication efficiency among and inside chips has become as important as the computation speeds of individual processor cores. Traditionally, inter-chip and intra-chip communication architectures are separately designed to maximize design flexibility under different constraints. However, jointly designing communication architectures for both inter-chip and intra-chip communication could potentially yield better solutions. In this paper, we present a unified inter/intra-chip optical network, called UNION, for chip multiprocessors (CMP). UNION is based on recent progress in nano-photonic technologies. It connects not only processors on a single CMP but also multiple CMPs in a system. UNION employs a hierarchical optical network to separate inter-chip communication traffic from intra-chip communication traffic. It fully utilizes a single optical network to transmit both payload packets and control packets. The network controller on each CMP not only manages intra-chip communications but also collaborate with each other to facilitate inter-chip communications. We compared CMPs using UNION with those using a matched electronic counterpart in 45 nm process. Based on eight applications, simulation results show that on average UNION improves CMP performance by 3.1X while reducing 92% of network energy consumption and 52% of communication delay.","PeriodicalId":306717,"journal":{"name":"2010 IEEE/ACM International Symposium on Nanoscale Architectures","volume":"563 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE/ACM International Symposium on Nanoscale Architectures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NANOARCH.2010.5510930","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21
Abstract
As modern computing systems become increasingly complex, communication efficiency among and inside chips has become as important as the computation speeds of individual processor cores. Traditionally, inter-chip and intra-chip communication architectures are separately designed to maximize design flexibility under different constraints. However, jointly designing communication architectures for both inter-chip and intra-chip communication could potentially yield better solutions. In this paper, we present a unified inter/intra-chip optical network, called UNION, for chip multiprocessors (CMP). UNION is based on recent progress in nano-photonic technologies. It connects not only processors on a single CMP but also multiple CMPs in a system. UNION employs a hierarchical optical network to separate inter-chip communication traffic from intra-chip communication traffic. It fully utilizes a single optical network to transmit both payload packets and control packets. The network controller on each CMP not only manages intra-chip communications but also collaborate with each other to facilitate inter-chip communications. We compared CMPs using UNION with those using a matched electronic counterpart in 45 nm process. Based on eight applications, simulation results show that on average UNION improves CMP performance by 3.1X while reducing 92% of network energy consumption and 52% of communication delay.