Highly manufacturable multi-layered ceramic surface mounted package

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI:10.1109/IEMT.1991.279830

F.F. Cappo, J. Milliken, J. Mosley

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引用次数: 3

Abstract

A surface mount package was designed in 1983 to satisfy a multi-chip cost-performance market requirement where a large number of components can be replaced with a few integrated devices in a single package. It was decided to use the IBM multi-layer ceramic (MLC) technology for the carrier substrate because of proven reliability, volume manufacturing capacity, multi-chip capability, wiring flexibility, and performance. Second, it was decided to use a specially designed surface-mount technology (SMT) interconnection to the card instead of the industry standard SMT or pin in hole because of I/O density, cost, and performance. The SMT interconnection was refined through theoretical and empirical investigation along with the low cost, high manufacturability requirement. The result was a high melting point Sn/Pb ball placed in a 0.50" grid array attached to the substrate and card using eutectic solder. Design concepts to aid in manufacturing are discussed together with the manufacturing/process design, and a typical example of this packaging technology is presented.<>

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高度可制造的多层陶瓷表面安装封装

表面贴装封装是在1983年设计的，以满足多芯片性价比的市场需求，即可以用单个封装中的几个集成器件替换大量组件。该公司决定使用IBM多层陶瓷(MLC)技术作为载体基板，因为它具有可靠的可靠性、批量制造能力、多芯片能力、布线灵活性和性能。其次，考虑到I/O密度、成本和性能，决定使用专门设计的表面贴装技术(SMT)与卡互连，而不是行业标准的SMT或孔内引脚。根据低成本、高可制造性的要求，通过理论和实证研究对SMT互连进行了细化。结果是一个高熔点的Sn/Pb球放置在0.50英寸的网格阵列中，并使用共晶焊料连接到衬底和卡片上。与制造/工艺设计一起讨论了帮助制造的设计概念，并提出了这种包装技术的典型示例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium

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