Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal

Abstract

Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.